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Feed Bowl Alignment Fixture

IP.com Disclosure Number: IPCOM000046669D
Original Publication Date: 1983-Aug-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Templin, LE [+details]

Abstract

In semiconductor chip-testing operations, the chip must be oriented in a desired orientation prior to being picked up by a vacuum pencil and placed on the electrodes of the test probe. The existing technique for orienting the chip is to place the chips in random orientation in a vibratory feed bowl which has an appropriate combination of orienting projections to orient the chips into the desired orientation and place them at the pickup point. A problem which has occurred in using vibratory feed bowls is that the overall orientation of the pickup point on the vibratory feed bowl will change from time-to-time due to external vibrations, adjustments, cleaning the feed bowl, various product sizes, maintaining the equipment, etc.