Surface Treatment of Polyimide to Facilitate Adhesion of Metallic Surface Layers
Original Publication Date: 1983-Aug-01
Included in the Prior Art Database: 2005-Feb-07
Oxidized carbon species formed on the surface of a polyimide layer as a result of a high temperature (250ŒC-270ŒC) condensation reaction are removed using an alkaline ferricyanide etch solution. This step both cleans the polyimide surface and renders it hydrophilic to improve adhesion of a subsequently evaporated aluminum layer. The alkaline ferricyanide solution is applied for a period of about 2 minutes at a temperature of 40ŒC.