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Surface Treatment of Polyimide to Facilitate Adhesion of Metallic Surface Layers

IP.com Disclosure Number: IPCOM000046939D
Original Publication Date: 1983-Aug-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Collins, GCS Morgan, WM [+details]

Abstract

Oxidized carbon species formed on the surface of a polyimide layer as a result of a high temperature (250ŒC-270ŒC) condensation reaction are removed using an alkaline ferricyanide etch solution. This step both cleans the polyimide surface and renders it hydrophilic to improve adhesion of a subsequently evaporated aluminum layer. The alkaline ferricyanide solution is applied for a period of about 2 minutes at a temperature of 40ŒC.