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Fabrication of Micron/Submicron Metal Lines Disclosure Number: IPCOM000047196D
Original Publication Date: 1983-Oct-01
Included in the Prior Art Database: 2005-Feb-07

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Lawson, J Patnaik, B Takacs, M [+details]


One of the lift-off methods utilizing polymethylsiloxane resin (also known as resin glass, spun-on-glass) as a barrier layer (U.S. Patent 4,004,044) is being used for the deposition of thin films in the fabrication of integrated circuits. One of the problems often encountered is the cracking of the electron beam sensitive terpolymer P(MMA-MA-MAA) layer and the underlying resin glass layer during the development cycle. The second problem is the excessive upward curling of the overhand ledge structure of the lift-off stencil during sputter cleaning (necessary for better electrical continuity) and/or during metal deposition.