Use of Pyrogenic/Tca System for Oxidation Processing
Original Publication Date: 1983-Oct-01
Included in the Prior Art Database: 2005-Feb-07
At the present time, a generator is used to vaporize water for oxidizing wafers. Incorporated into the oxidation process is gaseous HCl for the reduction of organic and metallic contamination. This process is inherently susceptible to an assortment of steam generator malfunctions and gaseous HCl leaks (corrosion). To minimize these deficiencies, a process was developed using hydrogen/oxygen to generate steam. Incorporated into this oxidation technique is the use of a bubbled solution of 1.1.1-trichoroethane to supply the needed reaction to generate a chloride source. This pyrogenic/TCA (trichloroethane)system furnishes a precise control for generating steam while eliminating the deleterious effects of corrosion when leaks occur.