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Browse Prior Art Database

Hybrid Laminated PC Board

IP.com Disclosure Number: IPCOM000047340D
Original Publication Date: 1983-Nov-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Chen, WT Christie, FR [+details]

Abstract

A multilayer laminated printed circuit (PC) board or the like has high temperature laminates for its outer laminates and lower temperature laminates for its inner or core laminates. The composite allows components to be bonded to the surface of the outermost laminates by soldering or welding without deleteriously effecting the adhesion bond of the board's metallurgy to its inner and outer laminates. The high temperature laminates also provide protection for the composite from solvent crazing and cracking or dimensional changes from swelling during the fabrication process of the board.