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Browse Prior Art Database

Chip-Mounting Structure Having an Intermediate Member

IP.com Disclosure Number: IPCOM000047348D
Original Publication Date: 1983-Nov-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Arnold, AF [+details]

Abstract

A structure for mounting an integrated circuit chip to a substrate which includes an intermediate member between the chip and the substrate is disclosed. Typically, a chip is mounted to a substrate by soldering an array of metal pads on the chip surface to a corresponding array of metal pads on the substrate. This approach has the advantages of simplicity and economy of manufacture. However, heat transfer from the chip to the substrate occurs only through the small diameter solder interconnections between the arrays of metal pads. In some applications it may be necessary to provide an additional heat sink to the opposed surface of the chip to provide sufficient heat dissipation.