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Thermal Enhancement Plate

IP.com Disclosure Number: IPCOM000047415D
Original Publication Date: 1983-Nov-01
Included in the Prior Art Database: 2005-Feb-07

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Related People

Crawford, DJ Liberman, HE Ronkese, BJ [+details]


Disclosed is a method to remove heat from ceramic modules. Modules with ceramic caps covering chips are mounted on printed circuit boards and then to a copper cold plate. The modules fit into cavities on the cold plate. In some configurations the gap between the cold plate and module cap is filled with a thermal grease to permit dissipation of heat away from the module to the cold plate. Another method of transferring heat, shown in the figure, is to use a thin corrugated plate 1 between the module 2 and cold plate 3. The corrugated plate can change in height to accommodate the cap size and has numerous contact points.