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Card Thermal Stress Tester

IP.com Disclosure Number: IPCOM000047477D
Original Publication Date: 1983-Nov-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Gaunt, DS [+details]

Abstract

Thermal cycling and burn-in of individual modules on a card at their optimum stress level, rather than stressing the whole card at a level determined by the worst-case module, is achieved by apparatus which is programmed to direct jets of hot or cold air selectively onto the components. Where cards, installed in a unit, are accessible from the outside, in situ stress testing can be performed with suitably modified apparatus. A schematic diagram of the thermal stress tester is shown in the figure. The tester consists of a plenum 1 having an air inlet 2 from a hot or cold switchable air supply (not shown), and an air outlet 3. The plenum is internally structured with an inlet chamber 4 and an outlet chamber 5, communication between the two being via a number of regularly spaced holes in a plenum orifice plate 7.