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Flow Distributor for Plating Tank Disclosure Number: IPCOM000047548D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue


Related People

Daley, LR Fellows, CJ Rood, HB Tucek, P [+details]


Tanks used for plating, such as those used to electrolessly plate copper onto printed circuit boards, are often relatively large. In order to get high quality plating it is essential that the fluid in such tanks be uniformly distributed and that the various chemicals which are added to the bath are adequately mixed prior to the time that the fluid comes in contact with the parts being plated. This is frequently accomplished by having a variety of distribution manifolds on the bottom of the plating tank. Often the holes in the manifolds have a graduated size distribution in order to compensate for the pressure differential in the distribution pipes. Added complexity is due to the fact that the plating reaction takes place both on the parts being plated and on the other elements in the tank, such as on the distribution manifolds.