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SELECT Au/Sn/Cu ALLOYS FOR TERMINAL PIN BRAZE

IP.com Disclosure Number: IPCOM000047572D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Ainslie, NG Marcotte, VC Palmateer, PH Sullivan, JF [+details]

Abstract

There is need in some processes for brazing terminal pins to electronic components for a higher melting (than 80% Au/20% Sn) pin braze alloy. Alloys of Au/Sn/Cu have been mentioned as being used for brazing electronic packages. However, there is an infinite number of alloys in the Au/Sn/Cu system with an infinite number of properties. What is described here is a select number of Au/Sn/Cu alloys with properties suitable for MLC (multilayer ceramic) pin brazing, as described in Table 1. Pin brazing is generally done for Au/Sn/Cu alloys up to a peak temperature of 175ŒC above the solidus with a 6-10 minute dwell (considerably longer than 80% Au/20% Sn alloy) at a temperature of 125ŒC above the solidus. Forming gas or hydrogen can be used as the brazing atmosphere.