Dismiss
The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

High Performance Chip-Cooling Technique

IP.com Disclosure Number: IPCOM000047596D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-07

Publishing Venue

IBM

Related People

Authors:
Hassan, JK Oktay, S Ostergren, CD Paivanas, JA [+details]

Abstract

A unique combination of mechanical and thermal properties is provided by this prescribed semiconductor chip-cooling technique, called the Spring Thermal Bridge (STB). The technique employs a small spring to load a disk heat-conducting member against the chip, and a circumferential spring around the disk and hat protrusion members that serve as a bridge to conduct heat from the disk to the hat. The latter spring, by virtue of its construction, also provides a mechanical flexibility to the disk, thus insuring full seating with the chip surface at a given contact load. OSTALLOY* is provided at the chip and conductive spring interfaces to achieve low interfacial thermal resistances. By this technique, internal thermal resistances less than 1.5 c/w are obtained at chip contact loads of less than 100 g.