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Process for Fabrication of High Resolution Plated Layers Disclosure Number: IPCOM000047729D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08

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Related People

Barlow, M Decker, SK [+details]


In the fabrication of magnetic thin film heads, the problems that arise when printing a fine pattern in a thick photoresist of varying thickness and levels are solved by the following lithographic process: A plating seed layer, which may be permalloy by way of example, is deposited by sputtering. A thin layer of titanium and then a thick resist are applied. The resist is cured by spin coating, baking and blanket exposure. Another thin titanium layer is deposited on the resist surface, and a thin layer of photoresist is then deposited. The high resolution pattern on the mask is then transferred into the thin layer of the resist by optical exposure and development. The second titanium layer is then patterned by sputter etching.