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Browse Prior Art Database

Microstrip Circuit Package Assembly

IP.com Disclosure Number: IPCOM000047809D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Cistola, AB [+details]

Abstract

A laminated circuit package assembly 1 includes pluggable plural microstrip laminated modules 2 and a mating common microstrip laminated receptacle 3. The advantages of laminated microstrip connectors are described, for example, in U.S. Patent 4,076,357. Controlled collapse chip connections (C4) solder bonds 4 (Fig. 2) are used for the first level connections between the module 2 and its integrated circuit (IC) chip 5. More particularly, the input/output (I/O) pads (not shown), located on the active side of the chip 5 are solder reflow bonded via C4 bonds 4 to the right angle bends (Fig. 2), formed on the resilient cantilever parallel extensions 6 of the planar conductors 7 of module 2. Module 2 has plural dielectric, e.g., polyimide, multi-ply laminates 8 that are interleaved with dielectric spacers S.