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Thermally Enhanced Integrated Circuit Chip Module

IP.com Disclosure Number: IPCOM000047843D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Aichelmann, FJ Jarvela, RA [+details]

Abstract

A metallized substrate 2 with solder pad connection of a single-device chip 1 thereto is shown in cross-section in Fig. 1. The substrate interfaces with a ceramic metallized thermal interposer 3 which is soldered to the deformed pins 4. The metallized pads on the interposer together with thermal grease 5 provide an additional thermal path from the chip through the pins to the substrate and the cap 6. Fig. 2 illustrates a multi-chip embodiment with the cap removed.