The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Semiconductor Module Encapsulant-Dispensing Technique

IP.com Disclosure Number: IPCOM000048010D
Original Publication Date: 1983-Dec-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue


Related People

Starr, SG [+details]


This is an improved technique for sealing a semiconductor package with an encapsulant, such as SCOTCHCAST*. The need for hermetically sealing semiconductor integrated circuit packages is well known, as is the need to contain the encapsulant material. One such technique was described in the IBM Technical Disclosure Bulletin, 23, 5042 (April 1981), in which a two-step encapsulating process was proposed to prevent sealant material from running into the interior surface of the module. The present technique is also a two-stage process. Illustrated in Fig. 1 is a top view of a corner of ceramic substrate 10 and outer package (usually metal can) 12. Solder balls 14 form electrical and mechanical connections to a second ceramic substrate.