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Spring Loaded Stamp Head

IP.com Disclosure Number: IPCOM000048143D
Original Publication Date: 1981-Dec-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Hasse, LE Visentin, JJ [+details]

Abstract

In one method (Fig.1) of marking elements, such as modules, the marking head pad is supported on a solid block, which requires a precise adjustment of travel (D) to achieve correct stamping pressure without damaging the module or smearing the ink. The time required for this critical adjustment results in longer set-up time impacting tool throughput and yield.