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Automatic Electrical Defect Detection on MLC Redistribution Sublaminates

IP.com Disclosure Number: IPCOM000048174D
Original Publication Date: 1981-Dec-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Simpson, RA Stickel, W [+details]

Abstract

Sublamination can significantly reduce the manufacturing capacity needed to produce a given number of multilayer ceramic (MLC) packaging substrates. It consists of dividing the stack of green sheets needed to produce a complete laminated substrate into sets of consecutive layers, grouped by function, that are pressed to form sublaminates and tested independently. A set of tested sublaminates is pressed to form a complete laminate.