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Method for Bonding a Spindle to a Bore

IP.com Disclosure Number: IPCOM000048214D
Original Publication Date: 1981-Dec-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Boscaini, G Dunquel, G Loda, L [+details]

Abstract

This article describes an improved method for bonding a spindle in a bore whereby uniform distribution of the bonding agent and perfect sealing are obtained.