Original Publication Date: 1982-Jan-01
Included in the Prior Art Database: 2005-Feb-08
It is often necessary to adapt wire bond configured chips for mounting onto substrates which are configured for flip-chip bonding. One way of adapting such wire bond configured chips for such mounting is by the use of a JEDEC (Joint Electron Device Engineering Council) chip carrier. The present technique provides a mounting for the JEDEC chip carrier which allows it to be attached directly to a flip-chip configured substrate without the need for any intermediate packaging layer.