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Silicone Overcoat Material Application Process Disclosure Number: IPCOM000048326D
Original Publication Date: 1982-Jan-01
Included in the Prior Art Database: 2005-Feb-08

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Related People

Audi, R Berger, R Noth, RW [+details]


With the advent of denser circuits having smaller devices, a problem has been encountered with soft failures due to alpha-particle emissions from the substrate material penetrating the silicon chip mounted on the substrate. In order to prevent or reduce such soft failures, a barrier layer can be applied between the chip and the substrate. This barrier layer must itself not be an alpha-particle emitter, must flow well, conform to the space between the chip and substrate, and be chemically and physically stable under operating and processing conditions.