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This resist enhances the dewet characteristics of the resist, increases the solubility of the photoactive compound (PAC), and reduces the amount of total solids in the resist solution.
English (United States)
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Diglyme/ Cyclohexanone Casting Solvent for Resists
This resist enhances the dewet characteristics of the resist, increases the
solubility of the photoactive compound (PAC), and reduces the amount of total
solids in the resist solution.
Described here is a new casting solvent for resists, which comprises a 50/50
wt/wt% mixture of cyclohexanone and diglyme. This solvent system has the
following advantages over the present solvent, diglyme: (a) the dewet
characteristics are improved; (b) the solubility of the PAC is higher so that it is
possible to formulate the resist with higher PAC content, pure PACs are soluble,
and the rate at which resin and PAC dissolve during formulation is increased; (c)
the same resist film thickness can be obtained from resist solutions which contain
lower total solid percentage than conventional formulation, thereby reducing PAC
and resin requirements.
Tentative results indicate that resists formulated with this casting solvent
perform equal to or better than the conventional formulation with respect to the
formation of striations in the resist and performance in a functional test which
measures the retio of development rates for exposed to unexposed resist at 10
micrometers per sq Coul.