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This rework process facilitates removal of stains and the like on a substrate that remain after electroless nickel and immersion gold coatings have been deposited on a metallized ceramic substrate.
English (United States)
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Electroless Plating Rework Process
This rework process facilitates removal of stains and the like on a substrate
that remain after electroless nickel and immersion gold coatings have been
deposited on a metallized ceramic substrate.
In semiconductor package fabrication in forming solder wettable pads on a
substrate, it is known to electroless deposit areas of nickel followed by selected
areas of gold deposited by immersion plating. Stain defects can appear after the
gold plating operation when all of the nickel salts used in the electroless nickel
deposition are not removed and the nickel is subsequently reduced by heat
treatment in hydrogen and displacement by the gold plating solution.
In this process the substrates are inspected following the gold plating
operation. If defects are noted, the gold layer is stripped, for example, in a
commercially available solution sold under the name of Technistrip by Technic,
Inc. The substrate is then cleaned in an O(2) plasma asher, and the nickel areas
replated with the gold plating bath.