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Automatic 2-3 Via Mask Design

IP.com Disclosure Number: IPCOM000048353D
Original Publication Date: 1982-Jan-01
Included in the Prior Art Database: 2005-Feb-08

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Capuron, JP Plassat, D [+details]


This article relates to an automatic via mask design, free of errors, wherein the number and areas of the via holes allowing the second and third metal levels to be connected are maximized to decrease the via hole resistance and voltage drop, thus optimizing the current densities.