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Use Of Alternate O-Ring Material And Protective Sleeve

IP.com Disclosure Number: IPCOM000048536D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Bartlett, AR [+details]

Abstract

In a number of semiconductor processing apparatus it is necessary to join two or more units by means of 0-rings compressed between the adjacent surfaces. When hot gases pass over the joint, rapid decay of the O-ring can occur, depending upon the temperature and composition of the gases and the ring itself. Even in the most destructive atmospheres it has now been found that such O-rings can have an extended life if a protective quartz sleeve is provided in the tube, such that it will prevent the gases from contacting the O-ring directly.