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Browse Prior Art Database

Removable Cap For Modules

IP.com Disclosure Number: IPCOM000048538D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Neumann, EW Viau, TL [+details]

Abstract

In the packaging of modules, it is desirable to provide a cover member which will allow for access to the module for any necessary reworking, e. g., replacing a defective chip. Such a cover member is shown in combination with a substrate and chip in Fig. 1, an exploded, longitudinal sectional view.