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High Temperature Coupling Agents (Adhesion Promoters) Via Plasma Synthesis Disclosure Number: IPCOM000048575D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08

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Anderson, HR Czornyj, G Eib, N Mittal, KL [+details]


The process described here provides a means to synthesize high temperature adhesion promoters which are needed to promote the adhesion of high temperature organic insulators (e.g., polyimides) for semiconductor devices.