Browse Prior Art Database

High Temperature Coupling Agents (Adhesion Promoters) Via Plasma Synthesis

IP.com Disclosure Number: IPCOM000048575D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Anderson, HR Czornyj, G Eib, N Mittal, KL [+details]

Abstract

The process described here provides a means to synthesize high temperature adhesion promoters which are needed to promote the adhesion of high temperature organic insulators (e.g., polyimides) for semiconductor devices.