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Enhanced Thermal Stability Of Simplified Lift-Off Structures

IP.com Disclosure Number: IPCOM000048584D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Field, CB Kristoff, JS Walton, EG [+details]

Abstract

Simplified lift-off structures, such as those generated by the chlorobenzine soak process or the like, are incompatible with energetic cleaning processes, such as sputter cleaning or ashing, used tor educe metal to silicon or metal to metal cotact resistance. This is a result of the thermal instability of the photoresist lift-off structure once temperatures of greater than or equal to 95 degrees C are achieved and photoresist reflow occurs.