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Chemical Smut Removal For MLC Plating Rework

IP.com Disclosure Number: IPCOM000048587D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Dzwilefsky, JW Miller, GA Pressman, FM Vitek, VM Weisman, RL [+details]

Abstract

An etchant solution is provided for removing I/O blisters occurring on TCM (thermal conduction module) substrates requiring subsequent plating rework.