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An etchant solution is provided for removing I/O blisters occurring on TCM (thermal conduction module) substrates requiring subsequent plating rework.
English (United States)
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Chemical Smut Removal For MLC Plating Rework
An etchant solution is provided for removing I/O blisters occurring on TCM
(thermal conduction module) substrates requiring subsequent plating rework.
Typically, a "smut" of moly oxide and organic contaminants remains on TCM
surface metallurgy after stripping the prior plating in KI/I(2) etchant. The smut
later prevents diffusion of nickel plating into the molybdenum and results in a
blister on the larger I/O pads. On the top surface, the features are too small to
blister, but the poor adhesion leads to bondability failures.
It has been shown that a 15-second dip, for example, in potassium
ferricyanide solution (K(3)Fe(CN)(6) - 215 g/1. KOH - 71.6 g/1) removes the
smut, prevents the formation of I/O blisters, and decreases bondability failures.
Prior to this approach. removal of moly oxides and hydroxides was
accomplished by mechanical means. This caused oxides to become imbedded
in the ceramic, and later resulted in electroless nickel plating on the ceramic.