Browse Prior Art Database

Stress Relieved And Low Thermal Resistance Structure For Cooling Solder Bonded Semiconductor Devices

IP.com Disclosure Number: IPCOM000048607D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Oktay, S Ostergren, CD [+details]

Abstract

This structure enables high chip power dissipating capability to be achieved in a non-hermetic air environment with minimum stress applied to a device. This advantage is achieved by using a bellows structure for conducting heat from a semiconductor device to a cold plate.