Stress Relieved And Low Thermal Resistance Structure For Cooling Solder Bonded Semiconductor Devices
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08
This structure enables high chip power dissipating capability to be achieved in a non-hermetic air environment with minimum stress applied to a device. This advantage is achieved by using a bellows structure for conducting heat from a semiconductor device to a cold plate.