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Stress Relieved And Low Thermal Resistance Structure For Cooling Solder Bonded Semiconductor Devices Disclosure Number: IPCOM000048607D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08

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Oktay, S Ostergren, CD [+details]


This structure enables high chip power dissipating capability to be achieved in a non-hermetic air environment with minimum stress applied to a device. This advantage is achieved by using a bellows structure for conducting heat from a semiconductor device to a cold plate.