Semiconductor Chip Cooling System With Temperature Regulation
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08
This cooling system comprises a liquid-cooled module with multilayer ceramic substrate 1 to which chips 2 to be cooled are soldered. Module cap 3, 4 and cooling liquid introduced in gap 5 between module cap 3, 4 and module cover 6 serve as a heat sink. Thermal contact between the surfaces of chips 2 and module cap 3, 4 is established by a thin foil 7 of rubber or plastic compounds and metal powder.