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Semiconductor Chip Cooling System With Temperature Regulation

IP.com Disclosure Number: IPCOM000048619D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08

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Related People

Brunsch, A Ruh, WD Trippel, G [+details]


This cooling system comprises a liquid-cooled module with multilayer ceramic substrate 1 to which chips 2 to be cooled are soldered. Module cap 3, 4 and cooling liquid introduced in gap 5 between module cap 3, 4 and module cover 6 serve as a heat sink. Thermal contact between the surfaces of chips 2 and module cap 3, 4 is established by a thin foil 7 of rubber or plastic compounds and metal powder.