Dismiss
The InnovationQ application will be updated on Sunday, May 31st from 10am-noon ET. You may experience brief service interruptions during that time.
Browse Prior Art Database

Semiconductor Chip Cooling System With Temperature Regulation

IP.com Disclosure Number: IPCOM000048619D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-08

Publishing Venue

IBM

Related People

Authors:
Brunsch, A Ruh, WD Trippel, G [+details]

Abstract

This cooling system comprises a liquid-cooled module with multilayer ceramic substrate 1 to which chips 2 to be cooled are soldered. Module cap 3, 4 and cooling liquid introduced in gap 5 between module cap 3, 4 and module cover 6 serve as a heat sink. Thermal contact between the surfaces of chips 2 and module cap 3, 4 is established by a thin foil 7 of rubber or plastic compounds and metal powder.