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Organic Contamination Detection During Wafer Processing

IP.com Disclosure Number: IPCOM000048639D
Original Publication Date: 1982-Feb-01
Included in the Prior Art Database: 2005-Feb-09

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Related People

Beam, DL Kroll, CT [+details]


This article describes a technique for detecting the presence of a contaminating film on a silicon wafer within a wafer processing cycle. The technique utilizes the difference in etch rates for silicon nitride films in the presence and in the absence of a contaminating film.