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Hot Stamping Metallized Circuit

IP.com Disclosure Number: IPCOM000048703D
Original Publication Date: 1982-Mar-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Juchniewicz, JJ Mice, JL [+details]

Abstract

A circuit printing technique is provided which is derived from known hot stamping processes used for placing patterns on materials other than circuit board substrates.