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A circuit printing technique is provided which is derived from known hot stamping processes used for placing patterns on materials other than circuit board substrates.
English (United States)
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Hot Stamping Metallized Circuit
A circuit printing technique is provided which is derived from known hot
stamping processes used for placing patterns on materials other than circuit
This technique is useful in the fabrication of inexpensive mass produced
circuits. Circuit patterns are transferred from metallized foil to a substrate by
means of heat and pressure applied through a hot stamp die having the circuit
patterns on its operative surface. Unused metallized tape may be repositioned to
minimize waste in a subsequent operation.
An example of the use of this technique is producing an intricate circuit
pattern on a polymer disk to form a capacitive emitter.