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EC Pad Design Using A Polyimide Package

IP.com Disclosure Number: IPCOM000048773D
Original Publication Date: 1982-Mar-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Bedetti, FV Platt, A [+details]

Abstract

In applications using polyimide layers on ceramic substrates engineering change (EC) pads have been formed over the polyimide layer. However, this can result in polyimide breakdown during wire bonding. Described here is the fabrication of the EC pad through the polyimide to the substrate surface so as to conduct the energy required for wire bonding away from the polyimide-to-pad interface to the substrate, thereby preventing the thermal degradation of the polyimide immediately under the EC pad.