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Wire Guide That Eliminates Wire Breakage For Field Assisted Bonding

IP.com Disclosure Number: IPCOM000048813D
Original Publication Date: 1982-Mar-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue


Related People

Altimari, R Campagna, FJ Parker, D Rumke, HW [+details]


One of the methods proposed to lower the cost of AC plasma display fabrication is to bond discrete aluminum conductors directly to the glass plates using a field-assisted bonding technique. A wiring tool is required to produce a plasma panel with discrete fine wire conductors. Such wiring tool contains a nozzle guide for feeding the fine wire onto the gas panel glass plates. However, due to the field applied during the bonding process, the wire electrostatically attracts foreign particles to its surface, primarily dust particles, which collect inside the nozzle as the wire is fed. Eventually, the buildup of material inside the nozzle causes sufficient drag to break the wire.