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Cabling Method For Dual Wafer Magnetic Head Module

IP.com Disclosure Number: IPCOM000048861D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Chow, WW [+details]

Abstract

Cabling is provided to a multitrack thin film head by using two wafers the second wafer and has its connecting leads deposited to the outside edges. A second wafer has the connecting leads formed to its lower edge.