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Electrostatic Discharge Protection for Electrically Programmable Read Only Memory Package

IP.com Disclosure Number: IPCOM000048916D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Bakeman, PE [+details]

Abstract

This semiconductor module packaging technique provides physical protection of programming electrodes by eliminating the module socket pin normally present and replacing the pin with a conductive pad flush with, or recessed into, the surface of the module package.