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Alpha Particle Barrier for Flip Chip Bonded Semiconductor Devices

IP.com Disclosure Number: IPCOM000048965D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

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Related People

Mondou, ER Young, SP [+details]


The compound used to form the alpha particle barrier can be varied to tailor-stiffness, and is cleanable to facilitate a rework of the module.