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Shared EC Pad Design Disclosure Number: IPCOM000048967D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

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Hubacher, E [+details]


The disclosed structure is preferably utilized in a multilayer ceramic (MLC) packaging structure for mounting, interconnecting and cooling a large number of integrated circuit semiconductor devices (chips). The MLC packaging structure includes an internal metallurgy network (wiring) to which the chips are flip-chip connected by solder connections (C4s). The packaging structure, which may be generally of the type disclosed in U.S. Patent 4,245,273, also includes engineering change (EC) pads. Fig. 1 shows MLC wiring between C4s and EC pads. Fig. 2 shows the connections between C4s and EC pads plus the connection paths between two chips through the personality wiring (refer to line A, for example). If, for example, the buried line A in Fig.