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Chip Cooling Employing a Conformable Alloy

IP.com Disclosure Number: IPCOM000048982D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

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Related People

Hassan, JK Paivanas, JA [+details]


Very large-scale integrated circuit chips of high density and heat capacity are effectively cooled by interposing a low melting point bismuth alloy in the interface between the chip and the heat sink (hat) and applying a light compression force to the interface.