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Encapsulated Mercury Contact For Semiconductor Dies

IP.com Disclosure Number: IPCOM000048991D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Ecker, ME Grebe, KR Palmer, MJ [+details]

Abstract

The disclosed compliant electrical interconnection structure between a semiconductor integrated circuit chip and a substrate permits a very high thermal expansivity mismatch. As a result, a larger chip may be joined to a substrate with very little reliability impact due to cyclic thermal excursion. When mercury contacts are employed to provide the compliant electrical interconnections, an encapsulating medium, such as oil, gel or other suitable fluid, may be used to contain the mercury and its vapors.