Obtaining Topographic Plots Of Insulator Film Thickness Using A Temporary Liquid Metal Electrode
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
An improved liquid metal electrode allows scanning of dielectrics for measurement of surface topography to determine whether sufficient uniformity exists. This is a method of measuring the film thickness of a dielectric film for use in the packaging of chips by using a liquid metal electrode to contact the upper surface of a dielectric layer, i.e., polyimide film coated over underlying metallurgy. A mercury electrode is scanned over the surface of the polyimide while the capacitance of the dielectric is measured by an instrument connected to the underlying metallurgy and the mercury electrode.