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Socket Assembly for Pinless Array Integrated Circuit Package

IP.com Disclosure Number: IPCOM000049120D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Redmond, RJ Touw, TR [+details]

Abstract

In packaging semiconductor chips, one technique is to provide a ceramic substrate on which the chip is mounted. Vias filled with metal, such as W or Mo, extend through the ceramic substrate. These vias are then connected to pins, which insert into cards. One mode of connecting the vias to pins is by means of a pin array socket assembly which supports the required pins and attaches to the ceramic substrate to bring the pins into contact with the vias. An improved pin array socket is described which will accommodate a large number of pins in a small area.