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High Reliability Metallurgical Structure for Multilevel Substrate Wiring

IP.com Disclosure Number: IPCOM000049121D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Archey, WB Elias, KL Slattery, WJ [+details]

Abstract

One conventional technique for providing multiple layers of metallization on a packaging substrate is to utilize a ceramic base on which a first level of metallization is applied, over which first level a layer of polyimide is applied, followed by a second level of metallization on top of the polyimide. An improved second level of metallization is provided by this technique.