High Reliability Metallurgical Structure for Multilevel Substrate Wiring
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
One conventional technique for providing multiple layers of metallization on a packaging substrate is to utilize a ceramic base on which a first level of metallization is applied, over which first level a layer of polyimide is applied, followed by a second level of metallization on top of the polyimide. An improved second level of metallization is provided by this technique.