Browse Prior Art Database

Bonding Pad Transfer

IP.com Disclosure Number: IPCOM000049133D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Lubert, KJ [+details]

Abstract

Scrap or otherwise superfluous bonding pads are used to repair missing or damaged pads in a printed circuit (PC) board or the like.