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Scrap or otherwise superfluous bonding pads are used to repair missing or damaged pads in a printed circuit (PC) board or the like.
English (United States)
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Bonding Pad Transfer
Scrap or otherwise superfluous bonding pads are used to repair missing or
damaged pads in a printed circuit (PC) board or the like.
For example, normally a signal bond pad is generally provided between the
two engineering change (EC) printed circuit lands 11 and 12. The pad and lands
11 and 12 are part of the PC pattern located on the upper surface of the board
10, but for the sake of explanation the pad is missing, as shown in Fig. 1. The
pad interconnects the two signal lands 11 and 12, and if an EC is required at the
particular location the pad is disconnected from a predetermined one of the lands
11 and 12.
A replacement pad 13 (Fig. 2) is removed from a scrap board (not shown) by
any suitable means, e.g., a modeler's or hobbyist's knife. Pad 13 is then affixed
by an epoxy 14 to the board 10 at the site of the aforementioned missing pad
which is located between lands 11 and 12 and juxtaposed adjacent to the
bonding pad 15 of ground conductor 16. As a result, board 10 is made
operational and the EC can be effected to the desired land, e.g., land 12, by
bonding a wire lead 17 to it and pad 13, thereby obviating the need to scrap
board 10 because of the aforementioned missing pad.
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