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Browse Prior Art Database

Compact Low Profile VLSI IC Package

IP.com Disclosure Number: IPCOM000049134D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Gresko, AR [+details]

Abstract

Assembly 10 is a compact low profile configured package for an integrated circuit (IC) module with high density input/output interconnections. It is particularly useful for very large-scale integration (VLSI) applications.