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Compact Low Profile VLSI IC Package

IP.com Disclosure Number: IPCOM000049134D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09

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Related People

Gresko, AR [+details]


Assembly 10 is a compact low profile configured package for an integrated circuit (IC) module with high density input/output interconnections. It is particularly useful for very large-scale integration (VLSI) applications.