Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09
In a sputtering process for sputtering successive layers of metals on a polyimide layer affixed to a circuitized ceramic substrate, it has been found that there is a mitigation in the formation of the fine cracks in the polyimide layer when the substrate is allowed to cool after each metal layer is deposited. This results in an increase in product reliability and integrity. It is particularly useful in the formation of metallized ceramic polyimide (MCP) substrates (*).