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Disk Preform for Braze Joining Pins to Substrates

IP.com Disclosure Number: IPCOM000049152D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Miller, WR Palmateer, PH Potter, M [+details]

Abstract

This braze preform has laminated metal layers with a higher melting point central layer that permits a large number of re-heating steps to be added to the substrate without significant degradation of the brazed bond.