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Compact Thermal Conduction Module

IP.com Disclosure Number: IPCOM000049153D
Original Publication Date: 1982-May-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue

IBM

Related People

Authors:
Kumar, AH Ordonez, J [+details]

Abstract

Described is a design of and a method for the attachment of a hermetic cap, and an arrangement for cooling device chips in a multilayer module.