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Described is a design of and a method for the attachment of a hermetic cap, and an arrangement for cooling device chips in a multilayer module.
English (United States)
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Compact Thermal Conduction Module
Described is a design of and a method for the attachment of a hermetic cap,
and an arrangement for cooling device chips in a multilayer module.
With reference to Fig. 1, a nickel plated K0VAR* L-section flange 1 is first
brazed to a sintered molybdenum seal band 2 integral with the ceramic substrate 3. Copper can be used for brazing the flange directly to the molybdenum. Other
brazing alloys can be used after prior nickel plating of the seal band. A metal cap
4 is then placed on the flange 1 as shown and is sealed with solder preforms to
form the hermetic filler seal 5. If a eutectic Pb-Sn solder is used, the cap can be
removed or resealed by heating to about 200 degrees C.
The arrangement for cooling the chips is illustrated in Fig. 2.
Rectangular cooling blocks 6 of aluminum or copper are suspended
from the roof of the cap 4 using accordion springs 8 made of
beryllium copper or copper. The latter are either brazed or soldered
to the roof of the cap. When the cap is placed over the flange, the
individual cooling blocks will rest gently on the chips 7, making
good thermal contact. Any desired vertical displacement of the
cooling block will be accommodated by the folding or unfolding of the
The above arrangement for cooling and hermetic sealing makes the module
compact and easy to fabricate. * Trademark of Westinghouse Electric
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