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Plasma Synthesis of High Temperature Adhesion Promoters

IP.com Disclosure Number: IPCOM000049324D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

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Related People

Anderson, HR Araps, C Czornyj, G Eib, N Mittal, KL [+details]


There is need for high temperature adhesion promoters which can be used in conjunction with high temperature polymeric insulators (e.g., polyimide) for application with top surface metallurgy (TSM) technology of semiconductor devices. It is known that plasma deposited aminosilane is a good adhesion promoter for polyimide and other resins. However, plasma polymerized silanes cannot withstand the high temperatures (450 degrees C) C required for the processing of these insulators.