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A key problem of the automatic chip to ceramic substrate-joining assembly is guaranteeing that the chip pads are at the right position over the substrate conductive lands.
English (United States)
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Wet Control Tool for Semiconductor Chip Joining Assembly
A key problem of the automatic chip to ceramic substrate-joining assembly is
guaranteeing that the chip pads are at the right position over the substrate
This problem has been generally solved so far by visual inspection from the
chip edge, the control of at least 3 sides; therefore, this technique is rather time
consuming. In addition, it also has inherent limitations for part numbers where
the pads, disposed at the center of the chip, are not visible at all.
The equipment, described and depicted in Figs. 1 and 2, allows the control of
all types of chips. Defective alignment can also be corrected.
A sample substrate, such as provided by the chip-positioning machine, which
supports the chip affixed by a drop of flux, is first disposed under a slideable
head which bears a vacuum-operated pipette. The chip is separated from the
substrate, and raised due to the pipette and the Z motor which controls the head.
An optical arrangement (basically a set of prisms) which allows the between.
The operator can control the alignment with the binocular, and assures that the
chip pads and the conductive lands are correctly registered with respect to each
If the alignment is defective, the operator can correct it by operating the X, Y
and 0 control knobs. The displacements will be noted and introduced as
corrective inputs in the automatic chip-positioning machine for subsequent