Browse Prior Art Database

Wet Control Tool for Semiconductor Chip Joining Assembly Disclosure Number: IPCOM000049362D
Original Publication Date: 1982-Apr-01
Included in the Prior Art Database: 2005-Feb-09

Publishing Venue


Related People

Gonin, RV Lemoine, JM Pottier, B [+details]


A key problem of the automatic chip to ceramic substrate-joining assembly is guaranteeing that the chip pads are at the right position over the substrate conductive lands.